Advancing Next-Generation Optical Interconnects: CPO, OCS, and Heterogeneous Integration
With the rapidly growing demand for data transmission driven by AI, high-bandwidth and low-power optical interconnect technologies are becoming increasingly critical to semiconductor system architectures. As the industry moves from modular designs toward co-packaged optics (CPO), challenges such as thermo-mechanical stress and material compatibility are becoming increasingly important. This calls for integrated design platforms and models that can address packaging, materials, and multi-physics interactions.
