Rayleigh Vision Intelligence Co., Ltd. (hereinafter "RVi"), a Taiwan-based company specializing in optical engines and advanced packaging technology development, unveiled its latest innovations at IEEE ECTC 2026. RVi presented its work on flip-chip micro-VCSEL architecture, 3D packaging, proprietary mass transfer processes, and a 2D fiber array unit (FAU)—all converging into a manufacturable co-packaged optical engine designed for the AI data center era.
