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presenter group photo

RVi on Choosing Optical Interconnect for AI Heterogeneous Integration

RVi was invited to attend the TPCA (Taiwan Printed Circuit Association) annual flagship event, the 'Advanced Trends Symposium.' Dr. Sam Ho, Co-Founder and CTO, represented the company on stage at the 'Heterogeneous Integration in the AI Era: Silicon Photonics × 3D-IC' forum to share the latest trends in optical interconnect technology for the AI era.

RVi Decodes Scale-Up Optics at the 3PHI Alliance:3PHI poster

When Bandwidth Density Becomes the New Battleground: RVi Decodes Scale-Up Optics at the 3PHI Alliance

The AI and HPC race keeps pushing bandwidth density and power efficiency to new extremes — and the shorter the interconnect, the harder that gets! As copper hits the bandwidth ceiling and port constraints in scale-up architectures, Optical I/O isn't optional anymore. It's the inevitable path forward for next-gen semiconductors.

presenter group photo

RVi on Choosing Optical Interconnect for AI Heterogeneous Integration

RVi was invited to attend the TPCA (Taiwan Printed Circuit Association) annual flagship event, the 'Advanced Trends Symposium.' Dr. Sam Ho, Co-Founder and CTO, represented the company on stage at the 'Heterogeneous Integration in the AI Era: Silicon Photonics × 3D-IC' forum to share the latest trends in optical interconnect technology for the AI era.

RVi Decodes Scale-Up Optics at the 3PHI Alliance:3PHI poster

When Bandwidth Density Becomes the New Battleground: RVi Decodes Scale-Up Optics at the 3PHI Alliance

The AI and HPC race keeps pushing bandwidth density and power efficiency to new extremes — and the shorter the interconnect, the harder that gets! As copper hits the bandwidth ceiling and port constraints in scale-up architectures, Optical I/O isn't optional anymore. It's the inevitable path forward for next-gen semiconductors.

All Press Releases.

presenter group photo

RVi on Choosing Optical Interconnect for AI Heterogeneous Integration

RVi was invited to attend the TPCA (Taiwan Printed Circuit Association) annual flagship event, the 'Advanced Trends Symposium.' Dr. Sam Ho, Co-Founder and CTO, represented the company on stage at the 'Heterogeneous Integration in the AI Era: Silicon Photonics × 3D-IC' forum to share the latest trends in optical interconnect technology for the AI era.

RVi Decodes Scale-Up Optics at the 3PHI Alliance:3PHI poster

When Bandwidth Density Becomes the New Battleground: RVi Decodes Scale-Up Optics at the 3PHI Alliance

The AI and HPC race keeps pushing bandwidth density and power efficiency to new extremes — and the shorter the interconnect, the harder that gets! As copper hits the bandwidth ceiling and port constraints in scale-up architectures, Optical I/O isn't optional anymore. It's the inevitable path forward for next-gen semiconductors.

RVi engineer standing next to a research bulletin board.

Micro-VCSEL for Co-Packaged Optics: RVi's Optical Engine Breakthrough at ECTC 2026

Rayleigh Vision Intelligence Co., Ltd. (hereinafter "RVi"), a Taiwan-based company specializing in optical engines and advanced packaging technology development, unveiled its latest innovations at IEEE ECTC 2026. RVi presented its work on flip-chip micro-VCSEL architecture, 3D packaging, proprietary mass transfer processes, and a 2D fiber array unit (FAU)—all converging into a manufacturable co-packaged optical engine designed for the AI data center era.

presenter group photo

RVi on Choosing Optical Interconnect for AI Heterogeneous Integration

RVi was invited to attend the TPCA (Taiwan Printed Circuit Association) annual flagship event, the 'Advanced Trends Symposium.' Dr. Sam Ho, Co-Founder and CTO, represented the company on stage at the 'Heterogeneous Integration in the AI Era: Silicon Photonics × 3D-IC' forum to share the latest trends in optical interconnect technology for the AI era.

RVi Decodes Scale-Up Optics at the 3PHI Alliance:3PHI poster

When Bandwidth Density Becomes the New Battleground: RVi Decodes Scale-Up Optics at the 3PHI Alliance

The AI and HPC race keeps pushing bandwidth density and power efficiency to new extremes — and the shorter the interconnect, the harder that gets! As copper hits the bandwidth ceiling and port constraints in scale-up architectures, Optical I/O isn't optional anymore. It's the inevitable path forward for next-gen semiconductors.

RVi engineer standing next to a research bulletin board.

Micro-VCSEL for Co-Packaged Optics: RVi's Optical Engine Breakthrough at ECTC 2026

Rayleigh Vision Intelligence Co., Ltd. (hereinafter "RVi"), a Taiwan-based company specializing in optical engines and advanced packaging technology development, unveiled its latest innovations at IEEE ECTC 2026. RVi presented its work on flip-chip micro-VCSEL architecture, 3D packaging, proprietary mass transfer processes, and a 2D fiber array unit (FAU)—all converging into a manufacturable co-packaged optical engine designed for the AI data center era.

presenter group photo

RVi on Choosing Optical Interconnect for AI Heterogeneous Integration

RVi was invited to attend the TPCA (Taiwan Printed Circuit Association) annual flagship event, the 'Advanced Trends Symposium.' Dr. Sam Ho, Co-Founder and CTO, represented the company on stage at the 'Heterogeneous Integration in the AI Era: Silicon Photonics × 3D-IC' forum to share the latest trends in optical interconnect technology for the AI era.

RVi Decodes Scale-Up Optics at the 3PHI Alliance:3PHI poster

When Bandwidth Density Becomes the New Battleground: RVi Decodes Scale-Up Optics at the 3PHI Alliance

The AI and HPC race keeps pushing bandwidth density and power efficiency to new extremes — and the shorter the interconnect, the harder that gets! As copper hits the bandwidth ceiling and port constraints in scale-up architectures, Optical I/O isn't optional anymore. It's the inevitable path forward for next-gen semiconductors.

RVi engineer standing next to a research bulletin board.

Micro-VCSEL for Co-Packaged Optics: RVi's Optical Engine Breakthrough at ECTC 2026

Rayleigh Vision Intelligence Co., Ltd. (hereinafter "RVi"), a Taiwan-based company specializing in optical engines and advanced packaging technology development, unveiled its latest innovations at IEEE ECTC 2026. RVi presented its work on flip-chip micro-VCSEL architecture, 3D packaging, proprietary mass transfer processes, and a 2D fiber array unit (FAU)—all converging into a manufacturable co-packaged optical engine designed for the AI data center era.