
RVi on Choosing Optical Interconnect for AI Heterogeneous Integration
HSINCHU, June 25, 2026 —
RVi was invited to attend the TPCA (Taiwan Printed Circuit Association) annual flagship event, the 'Advanced Trends Symposium.' Dr. Sam Ho, Co-Founder and CTO, represented the company on stage at the 'Heterogeneous Integration in the AI Era: Silicon Photonics × 3D-IC' forum to share the latest trends in optical interconnect technology for the AI era.
After sharing at TPCA's Advanced Trends Forum, RVi's view is simple: The real bottleneck in AI scale-up isn't long reach — it's the sub-100m inside the rack, where copper hits both a bandwidth and a power ceiling, yet is the hardest stretch to replace with light.
RVi doesn't see this as "VCSEL or silicon photonics." It's the right light for the right reach: silicon photonics for long reach, VCSEL as the sweet spot for short-reach scale-up — and the next step in bandwidth density is moving VCSEL from wire bonding to flip-chip. Micro-VCSEL + mass transfer + AI-based optical inspection is how RVi is making that stretch manufacturable.
Thanks to TPCA for the platform.


