RVi group photo

RVi Recharge | A Mid-Autumn Gathering

HSINCHU, Sept 16, 2026 —

Ahead of Mid-Autumn 2026, RVi hosted a high-energy, well-deserved celebration. From a table full of authentic local dishes to an all-out mic battle on the karaoke stage, everyone brought the same focus and energy they bring to R&D — igniting the room. 

At RVi, we're committed to building breakthrough interconnect technology — and just as committed to the people who build it with us. This tight-knit team spirit is exactly what powers us to keep pushing the limits of technology. 

Happy Mid-Autumn Festival to everyone! 

If you're passionate about interconnect technology, follow RVi for our latest updates and career opportunities — and help us define what's next for optical interconnect.

RVi group photo(1)RVi group photo(2)RVi menbers singingRVi menber singing on the stage

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RVi menbers and Dr. Yang Meeting Photo

Advancing Next-Generation Optical Interconnects: CPO, OCS, and Heterogeneous Integration

With the rapidly growing demand for data transmission driven by AI, high-bandwidth and low-power optical interconnect technologies are becoming increasingly critical to semiconductor system architectures. As the industry moves from modular designs toward co-packaged optics (CPO), challenges such as thermo-mechanical stress and material compatibility are becoming increasingly important. This calls for integrated design platforms and models that can address packaging, materials, and multi-physics interactions.

RVi menbers and Dr. Yang Meeting Photo

Advancing Next-Generation Optical Interconnects: CPO, OCS, and Heterogeneous Integration

With the rapidly growing demand for data transmission driven by AI, high-bandwidth and low-power optical interconnect technologies are becoming increasingly critical to semiconductor system architectures. As the industry moves from modular designs toward co-packaged optics (CPO), challenges such as thermo-mechanical stress and material compatibility are becoming increasingly important. This calls for integrated design platforms and models that can address packaging, materials, and multi-physics interactions.