Rayleigh Vision
Rayleigh Vision
  • Home
  • About Us
  • Solutions
    • Optical Communication
    • AI Smart Manufacturing
    • Extended Reality
    • Medical Device
  • Newsroom
  • Contact Us
  • 更多
    • Home
    • About Us
    • Solutions
      • Optical Communication
      • AI Smart Manufacturing
      • Extended Reality
      • Medical Device
    • Newsroom
    • Contact Us

  • Home
  • About Us
  • Solutions
    • Optical Communication
    • AI Smart Manufacturing
    • Extended Reality
    • Medical Device
  • Newsroom
  • Contact Us

Optical Communication 光通訊技術

Co-packaged optics (CPO) represents a pivotal advancement in addressing the escalating energy demands of data centers, which now consume approximately 2% of global electricity—comparable to the energy usage of an entire nation such as Germany. Notably, up to 40% of AI computation energy is expended on data transfer processes, a stark inefficiency that hinders overall system performance. 


CPO offers a transformative solution by significantly enhancing data transmission speeds and alleviating network bottlenecks. However, the high power consumption associated with current CPO implementations remains a critical challenge. Advancing CPO technology is imperative to enable sustainable scalability in AI and data-driven applications while mitigating its environmental and operational impact. 


共同封裝光學(CPO)是解決數據中心能源需求激增的關鍵進展。當前,數據中心的能源消耗已佔全球電力的約2%,相當於德國等國家的用電量。值得注意的是,高達40%的AI計算能源被消耗在數據傳輸過程中,這種顯著的效率低下阻礙了整體系統的性能發揮。


CPO通過顯著提升數據傳輸速度並緩解網絡瓶頸,提供了一種變革性解決方案。然而,目前CPO實現中高能耗的問題仍然是一大挑戰。推進CPO技術的發展對於實現AI和數據驅動應用的可持續擴展至關重要,同時能有效減少其對環境和運營的影響。

Today’s CPO Needs Rethinking

Today’s CPO architecture is complex and hard to scale up

  • Bulky system architecture 
  • Temperature Sensitive
  • Unsatisfied yield rate due to non-flexible design
  • Not compatible to modern silicon foundry  


現有的CPO架構過於複雜,難以普及

  • 過於龐大的系統架構
  • 對溫度變化敏感
  • 良率受到死板系統元件設計所限
  • 與現有矽基晶圓製程不兼容

RVI's Optical Link Solution

We offer a compact, scalable optical engine based on a dense 2D array light source

  • Thermal-Aware Architecture: 
  • Achieves over 6.4 Tbps 
  • Consumes less than 5 pJ/bit 
  • AI-Assisted Mass Transfer & Repair: 
  • 12-inch Wafer-Scale Integration


我們提供基於高密度2D陣列光源的緊湊且可擴展的光引擎,專為先進數據通信系統設計 

  • 熱優化架構容許溫度變化 
  • 傳輸速率超過6.4 Tbps。
  • 功耗低於5 pJ/bit,實現高能效。
  • AI輔助大規模轉移與修復: 
  • 兼容12英寸晶圓級製程

Leveraging our AI smart manufacturing capabilities

 >10,000 Devices Transferred 

Per Laser Pulse 

 Industry-Proven Mass Transfer Technologies

12-inch WLP Compatible 

Silicon Interposer Design

 Smart Repair System Achieving 100% Functional Yield 

 Full-stack (EL + AOI + PL) 

Mass Inspection Pipeline

 Precise Alignment for 250 μm Pitch Fiber Array Coupling

Interested in our technologies and want to collaborate?

Contact Us
  • Home
  • About Us
  • Newsroom
  • Contact Us

RVI

300新竹市東區水利路81號 5樓之3

03-575-2911

Copyright © 2025 Rayleigh Vision Intelligence Co. Ltd. — All rights are preserved

提供者:

此網站使用 cookie。

我們會使用 cookie 分析網站流量,並為您最佳化網站的使用體驗。您接受我們使用 cookie,即表示您的資料會和其他使用者的資料進行整合。

拒絕接受