Microdisplay Technologies 微型顯示器技術
Why MicroLED is suitable for XR? 為甚麼MicroLED才是XR裝置的終極技術？
MicroLED is generally interpreted as the next-generation light emitting technology. It utilizes <50 μm LED as individual pixel elements to achieve ultra-high resolution, true RGB pixels, high brightness, fast response, and power efficiency, which outperform every traditional display technology.
MicroLED通常被視為下一代發光技術。它使用小於50微米的LED作為獨立像素元件，可實現超高解析度、真RGB像素、高亮度、快速反應和高能源效率，性能超越所有傳統顯示技術。
Why are RVI's technologies game-changer? 為甚麼我們的技術是規則改變者？
RVI pioneers advanced 3D MicroLED stacking technologies, enabling the possibility of ultra-high-density True-RGB displays. Our innovative pixel architecture also facilitates easy pixel repair, significantly enhancing production efficiency. By improving performance and manufacturability, RVI makes it possible to bring cutting-edge MicroLED technology to the market with reasonable yields and costs.
RVI率先開發先進的3D MicroLED堆疊技術，使超高密度True-RGB顯示成為可能。我們創新的像素架構還能實現便捷的像素修復，大幅提升生產效率。通過改善性能和製造可行性，RVI成功將尖端的MicroLED技術以合理的良率和成本推向市場。
Stacked MicroLED Microdisplay Technology 堆疊式MicroLED微型顯示技術
The Company’s stacked full-color RGB offers numerous benefits. It can achieve ultra-high 8K resolution in microdisplay, and true RGB pixels in the MicroLED panel enhance image sharpness and color performance.
Planar structure works well for large displays with low pixel density but struggles with high pixel density devices. Since RGB chips need separate positions on the backplane, this occupies about four times more area than stacked structures, thus limiting the ultimate pixel density.
Pixels with stacked structure can be fabricated smaller since R, G, and B chips occupy roughly the area of one MicroLED chip. As a result, the Company’s design enables more efficient and better-performing products compared to traditional designs.
本公司的堆疊式全彩RGB技術具備多項優勢。它能在微型顯示器中實現超高8K解析度，而真RGB像素的MicroLED面板可提升影像銳利度和色彩表現。
平面結構適用於低像素密度的大型顯示器，但在高像素密度裝置上則面臨挑戰。由於RGB晶片需要在背板上分別佔據位置，這比堆疊結構多佔用約四倍面積，因此限制了最終像素密度。
堆疊結構的像素可製作得更小，因為R、G、B晶片大約只占用一個MicroLED晶片的面積。因此，本公司的設計相較傳統設計能實現更高效能、更佳性能的產品。
Stacked-MicroLED-in-Package 堆疊式封裝式MicroLED (MiP)
The world's smallest MicroLED-in-Package Product based on stacking technology.
Compared to conventional MicroLED chip:
- Provides bin-sorting data of each stacked chip
- Enables wafer/panel-level bonding
- Full-color pixel occupies 2x smaller area
- Offers 3x higher overall chip yield
- Allows RGB to be transferred simultaneously
(Reduced transfer steps by 3 times)
基於堆疊技術打造全球最小的堆疊式封裝MicroLED產品，相較於傳統MicroLED晶片具備以下優勢：
- 提供各堆疊晶片的分箱分級數據
- 實現晶圓/面板級接合技術
- 全彩像素占用面積減少一半
- 整體晶片良率提升三倍
- RGB可同步轉移（轉移步驟減少至三分之一）