RVi's New Facility Underway — Capacity Expansion in Motion!

2026/10/05, Zhunan —

In 2026, RVi is building the first production line dedicated to Micro-VCSEL mass transfer and inspection for optical communication. 

This isn't just another facility build-out — it's a critical step toward breaking through the AI compute and optical bandwidth bottleneck we're all racing against. 

AI compute keeps growing at an exponential pace, and the bandwidth for data moving in and out of chips can't keep up. Shrinking the light source and bringing it right up to the chip — that's the industry's answer. And it takes two things happening at once: transferring sub-100μm optical dies onto packaging substrates with micron-level precision, and using AI-based inspection to screen every single die, optical and electrical, down to Known-Good-Die — turning yield into something predictable instead of a guessing game. 

Precision mass transfer and intelligent inspection: that's what decides how far the next generation of optical interconnect can go. 

Sub-100μm optical dies. Micron-level transfer precision. AI-driven, die-by-die yield screening. This line is where we turn that technical capability into real production scale.